Wednesday - December 25, 2024

Structures for Word Line Multiplexing in Three-Dimensional Memory Arrays

2024-10-29

ALEXANDRIA, Virginia, Oct. 29 -- MICRON TECHNOLOGY, INC., Boise, Idaho has been assigned a patent (No. US 12131794 B2, initially filed Aug. 23, 2022) developed by three inventors Fatma Arzum Simsek-Ege, Boise, Idaho; Mingdong Cui, Folsom, California; and Richard E. Fackenthal, Carmichael, California, for "Structures for word line multiplexing in three-dimensional memory arrays." . . .

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Structures for Word Line Multiplexing in Three-Dimensional Memory Arrays

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