Wednesday - December 25, 2024

Semiconductor Packages With Patterns of Die-Specific Information

2024-10-29

ALEXANDRIA, Virginia, Oct. 29 -- MICRON TECHNOLOGY, INC., Boise, Idaho has been assigned a patent (No. US 12131916 B2, initially filed May 4, 2021) developed by Federico Pio, Brugherio, Italy, for "Semiconductor packages with patterns of die-specific information." . . .

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Semiconductor Packages With Patterns of Die-Specific Information

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