Thursday - December 26, 2024

Slurry Composition, Semiconductor Structure and Method for Forming the Same

2024-10-29

ALEXANDRIA, Virginia, Oct. 29 -- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, Taiwan has been assigned a patent (No. US 12131944 B2, initially filed Aug. 30, 2021) developed by ten inventors Chun-Wei Hsu, Hsinchu, Taiwan; Chih-Chieh Chang, Hsinchu County, Taiwan; Yi-Sheng Lin, Taichung, Taiwan; Jian-Ci Lin, Hsinchu, Taiwan; Jeng-Chi Lin, Hsinchu, Taiwan; Ting-Hsun Chang, Kaohsiung, Taiwan; Liang-Guang Chen, Hsinchu, Taiwan; Ji Cui, Bolingbrook, Illinois; Kei-Wei Chen, Tainan, Taiwan . . .

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Slurry Composition, Semiconductor Structure and Method for Forming the Same

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