Wednesday - December 25, 2024

Metal-Coated, Polymer-Encapsulated Electronics Modules and Methods for Making the Same

2024-10-29

ALEXANDRIA, Virginia, Oct. 29 -- GM GLOBAL TECHNOLOGY OPERATIONS LLC, Detroit, Michigan has been assigned a patent (No. US 12132010 B2, initially filed April 8, 2021) developed by three inventors Anthony M. Coppola, Rochester Hills, Michigan; Seongchan Pack, West Bloomfield, Michigan; and Ming Liu, Troy, Michigan, for "Metal-coated, polymer-encapsulated electronics modules and methods for making the same." . . .

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Metal-Coated, Polymer-Encapsulated Electronics Modules and Methods for Making the Same

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