Thursday - December 26, 2024

Electronic Systems With Inverted Circuit Board With Heat Sink to Chassis Attachment

2024-10-29

ALEXANDRIA, Virginia, Oct. 29 -- INTEL CORPORATION, Santa Clara, California has been assigned a patent (No. US 12131977 B2, initially filed Oct. 31, 2023) developed by fifteen inventors Barrett M. Faneuf, Beaverton, Oregon; Phil Geng, Washougal, Washington; Kenan Arik, Hillsboro, Oregon; David Shia, Portland, Oregon; Casey Winkel, Hillsboro, Oregon; Sandeep Ahuja, Portland, Oregon; Eric D. McAfee, Portland, Oregon; Jeffory L Smalley, East Olympia, Washington; Minh T. D. Le, North Plains, Oregon; . . .

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Electronic Systems With Inverted Circuit Board With Heat Sink to Chassis Attachment

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