Apparatus Including Arrays of Pick-Up Heads and Bonding Heads and a Method of Using the Same
Copyright © Targeted News Service 2024
2024-10-29
ALEXANDRIA, Virginia, Oct. 29 -- CANON KABUSHIKI KAISHA, Tokyo, Japan has been assigned a patent (No. US 12131926 B2, initially filed Nov. 8, 2022) developed by Byung-Jin Choi, Austin, Texas, for "Apparatus including arrays of pick-up heads and bonding heads and a method of using the same." . . .