Thursday - December 26, 2024

Semiconductor Device Assembly With Pre-Reflowed Solder

2024-10-29

ALEXANDRIA, Virginia, Oct. 29 -- TEXAS INSTRUMENTS INC., Dallas, Texas has been assigned a patent (No. US 12132027 B2, initially filed Oct. 19, 2020) developed by three inventors James Raymond Maliclic Baello, Pampanga, Philippines; Steffany Ann Lacierda Moreno, Tarlac, Philippines; and Jose Carlos Arroyo, Allen, Texas, for "Semiconductor device assembly with pre-reflowed solder." . . .

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Semiconductor Device Assembly With Pre-Reflowed Solder

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