Wednesday - December 25, 2024

Plasma Processing Apparatus and Plasma Processing Method

2024-10-29

ALEXANDRIA, Virginia, Oct. 29 -- HITACHI HIGH-TECH CORPORATION, Tokyo, Japan has been assigned a patent (No. US 12131964 B2, initially filed Aug. 1, 2022) developed by six inventors Kousuke Fukuchi, Tokyo, Japan; Ryoji Asakura, Hillsboro, Oregon; Soichiro Eto, Tokyo, Japan; Tsubasa Okamoto, Tokyo, Japan; Tatehito Usui, Tokyo, Japan; and Shigeru Nakamoto, Tokyo, Japan, for "Plasma processing apparatus and plasma processing method." . . .

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Plasma Processing Apparatus and Plasma Processing Method

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