Thursday - December 26, 2024

Supports for Thinned Semiconductor Substrates and Related Methods

2024-10-29

ALEXANDRIA, Virginia, Oct. 29 -- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, Arizona has been assigned a patent (No. US 12132005 B2, initially filed Nov. 13, 2023) developed by Michael J. Seddon, Gilbert, Arizona, and Francis J. Carney, Mesa, Arizona, for "Supports for thinned semiconductor substrates and related methods." . . .

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Supports for Thinned Semiconductor Substrates and Related Methods

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