Wednesday - December 25, 2024

Cooling Mass and Spring Element for Low Insertion Force Hot Swappable Electronic Component Interface

2024-10-29

ALEXANDRIA, Virginia, Oct. 29 -- INTEL CORPORATION, Santa Clara, California has been assigned a patent (No. US 12133368 B2, initially filed March 17, 2022) developed by four inventors Hardeep Singh, Foslom, California; Rachit Sharma, Vancouver, Canada; Timothy Glen Hanna, Tigard, Oregon; and Devdatta P. Kulkarni, Portland, Oregon, for "Cooling mass and spring element for low insertion force hot swappable electronic component interface." . . .

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Cooling Mass and Spring Element for Low Insertion Force Hot Swappable Electronic Component Interface

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