Hermetic Metallized via With Improved Reliability
Copyright © Targeted News Service 2024
2024-10-29
ALEXANDRIA, Virginia, Oct. 29 -- CORNING INC., Corning, New York has been assigned a patent (No. US 12131985 B2, initially filed Sept. 9, 2021) developed by six inventors Mandakini Kanungo, Painted Post, New York; Prantik Mazumder, Ithaca, New York; Chukwudi Azubuike Okoro, Painted Post, New York; Ah-Young Park, Daejeon, South Korea; Scott Christopher Pollard, Big Flats, New York; and Rajesh Vaddi, Horseheads, New York, for "Hermetic metallized via with improved reliability." . . .