Thursday - December 26, 2024

PIC Die and Package With Multiple Level and Multiple Depth Connections of Fibers to On-Chip Optical Components

2024-10-29

ALEXANDRIA, Virginia, Oct. 29 -- GLOBALFOUNDRIES U.S. INC., Malta, New York has been assigned a patent (No. US 12130470 B2, initially filed Oct. 25, 2021) developed by three inventors Nicholas A. Polomoff, Hopewell Junction, New York; Thomas Houghton, Marlboro, New York; and Yusheng Bian, Ballston Lake, New York, for "PIC die and package with multiple level and multiple depth connections of fibers to on-chip optical components." . . .

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PIC Die and Package With Multiple Level and Multiple Depth Connections of Fibers to On-Chip Optical Components

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