Thursday - December 26, 2024

Monitoring Copper Corrosion in an Integrated Circuit Device

2024-10-29

ALEXANDRIA, Virginia, Oct. 29 -- MICROCHIP TECHNOLOGY INC., Chandler, Arizona has been assigned a patent (No. US 12130241 B2, initially filed Jan. 4, 2023) developed by Yaojian Leng, Portland, Oregon, for "Monitoring copper corrosion in an integrated circuit device." . . .

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Monitoring Copper Corrosion in an Integrated Circuit Device

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