Ovenable Package
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2024-10-29
ALEXANDRIA, Virginia, Oct. 29 -- AMCOR FLEXIBLES NORTH AMERICA, INC., Neenah, Wisconsin has been assigned a patent (No. US 12129098 B2, initially filed Nov. 20, 2018) developed by Reinaldo Caleman, Jr., Neenah, Wisconsin, for "Ovenable package." . . .