Wednesday - December 25, 2024

Etched Trenches in Bond Materials for Die Singulation, and Associated Systems and Methods

2024-10-29

ALEXANDRIA, Virginia, Oct. 29 -- MICRON TECHNOLOGY, INC., Boise, Idaho has been assigned a patent (No. US 12132155 B2, initially filed Jan. 11, 2021) developed by three inventors Vladimir Odnoblyudov, Eagle, Idaho; Scott D. Schellhammer, Meridian, Idaho; and Jeremy S. Frei, Boise, Idaho, for "Etched trenches in bond materials for die singulation, and associated systems and methods." . . .

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Etched Trenches in Bond Materials for Die Singulation, and Associated Systems and Methods

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