Thursday - December 26, 2024

Semiconductor Package and Passive Element With Interposer

2024-10-29

ALEXANDRIA, Virginia, Oct. 29 -- INFINEON TECHNOLOGIES AG, Neubiberg, Germany has been assigned a patent (No. US 12131988 B2, initially filed Nov. 14, 2023) developed by three inventors Angela Kessler, Sinzing, Germany; Robert Carroll, Andover, Massachusetts; and Robert Fehler, Regensburg, Germany, for "Semiconductor package and passive element with interposer." . . .

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Semiconductor Package and Passive Element With Interposer

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