Friday - December 27, 2024

Circuit Board Interconnection Device and Circuit Board Assembly

2024-10-22

ALEXANDRIA, Virginia, Oct. 22 -- BORGWARNER INC., Auburn Hills, Michigan has been assigned a patent (No. US 12127344 B2, initially filed Oct. 21, 2021) developed by five inventors Sisay Tadele, Friolzheim, Germany; Riza Oguz, Esslingen a. N., Germany; Alexander Dauth, Maulbronn, Germany; Michael Krappel, Stuttgart, Germany; and Michael Degendorfer, Schwaikheim, Germany, for "Circuit board interconnection device and circuit board assembly." . . .

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Circuit Board Interconnection Device and Circuit Board Assembly

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