Friday - December 27, 2024

Semiconductor Device and Method of Forming the Same

2024-10-22

ALEXANDRIA, Virginia, Oct. 22 -- MICRON TECHNOLOGY, INC., Boise, Idaho has been assigned a patent (No. US 12125789 B2, initially filed Sept. 26, 2022) developed by five inventors Shigeru Sugioka, Higashihiroshima, Japan; Hidenori Yamaguchi, Higashihiroshima, Japan; Noriaki Fujiki, Kawanishi, Japan; Keizo Kawakita, Higashihiroshima, Japan; and Raj K. Bansal, Taichung, Taiwan, for "Semiconductor device and method of forming the same." . . .

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Semiconductor Device and Method of Forming the Same

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