Friday - December 27, 2024

Semiconductor Die Assemblies With Decomposable Materials and Associated Methods and Systems

2024-10-22

ALEXANDRIA, Virginia, Oct. 22 -- MICRON TECHNOLOGY, INC., Boise, Idaho has been assigned a patent (No. US 12125796 B2, initially filed Nov. 13, 2023) developed by three inventors Fatma Arzum Simsek-Ege, Boise, Idaho; Luoqi Li, Boise, Idaho; and Marsela Pontoh, Boise, Idaho, for "Semiconductor die assemblies with decomposable materials and associated methods and systems." . . .

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Semiconductor Die Assemblies With Decomposable Materials and Associated Methods and Systems

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