Friday - December 27, 2024

Chip Integration Into Cavities of a Host Wafer Using Lateral Dielectric Material Bonding

2024-10-22

ALEXANDRIA, Virginia, Oct. 22 -- PSEUDOLITHIC, INC., Santa Barbara, California has been assigned a patent (No. US 12125759 B2, initially filed June 12, 2023) developed by four inventors Florian Herrault, Agoura Hills, California; Isaac Rivera, Buena Park, California; Daniel S. Green, McLean, Virginia; and James F. Buckwalter, Santa Barbara, California, for "Chip integration into cavities of a host wafer using lateral dielectric material bonding." . . .

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Chip Integration Into Cavities of a Host Wafer Using Lateral Dielectric Material Bonding

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