Friday - December 27, 2024

Semiconductor Device Assemblies and Systems With One or More Dies at Least Partially Embedded in a Redistribution Layer (RDL) and Methods for Making the Same

2024-10-22

ALEXANDRIA, Virginia, Oct. 22 -- MICRON TECHNOLOGY, INC., Boise, Idaho has been assigned a patent (No. US 12125816 B2, initially filed June 9, 2021) developed by Jong Sik Paek, Taichung, Taiwan, and Po Chih Yang, Taichung, Taiwan, for "Semiconductor device assemblies and systems with one or more dies at least partially embedded in a redistribution layer (RDL) and methods for making the same." . . .

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Semiconductor Device Assemblies and Systems With One or More Dies at Least Partially Embedded in a Redistribution Layer (RDL) and Methods for Making the Same

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