Friday - December 27, 2024

Wafer-Level Stacked Die Structures and Associated Systems and Methods

2024-10-22

ALEXANDRIA, Virginia, Oct. 22 -- MICRON TECHNOLOGY, INC., Boise, Idaho has been assigned a patent (No. US 12125826 B2, initially filed Aug. 11, 2022) developed by Chih Yuan Chang, New Taipei, Taiwan, for "Wafer-level stacked die structures and associated systems and methods." . . .

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Wafer-Level Stacked Die Structures and Associated Systems and Methods

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