Friday - December 27, 2024

Three-Dimensional Memory Device Containing Self-Aligned Isolation Strips and Methods for Forming the Same

2024-10-22

ALEXANDRIA, Virginia, Oct. 22 -- SANDISK TECHNOLOGIES LLC, Addison, Texas has been assigned a patent (No. US 12127406 B2, initially filed Jan. 18, 2022) developed by three inventors Takaaki Iwai, Yokkaichi, Japan; Takashi Inomata, Yokkaichi, Japan; and Takayuki Maekura, Yokkaichi, Japan, for "Three-dimensional memory device containing self-aligned isolation strips and methods for forming the same." . . .

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Three-Dimensional Memory Device Containing Self-Aligned Isolation Strips and Methods for Forming the Same

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