Panel Clip Assembly and Related Method of Use
Copyright © Targeted News Service 2024
2024-10-22
ALEXANDRIA, Virginia, Oct. 22 -- A. RAYMOND ET CIE, Grenoble, France has been assigned a patent (No. US 12123447 B2, initially filed Sept. 1, 2022) developed by Michael Murray, Birmingham, Michigan, and Miroslaw Przybyl, Lake Orion, Michigan, for "Panel clip assembly and related method of use." . . .