Friday - December 27, 2024

Semiconductor Device Packaging Warpage Control

2024-10-22

ALEXANDRIA, Virginia, Oct. 22 -- NXP USA, INC., Austin, Texas has been assigned a patent (No. US 12125716 B2, initially filed June 3, 2021) developed by five inventors Zhiwei Gong, Chandler, Arizona; Scott M. Hayes, Chandler, Arizona; Michael B. Vincent, Chandler, Arizona; Vivek Gupta, Phoenix, Arizona; and Richard Te Gan, Chandler, Arizona, for "Semiconductor device packaging warpage control." . . .

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