Friday - December 27, 2024

Integrated Method for Low-Cost Wide Band Gap Semiconductor Device Manufacturing

2024-10-22

ALEXANDRIA, Virginia, Oct. 22 -- THINSIC INC., Santa Clara, California has been assigned a patent (No. US 12125697 B2, initially filed Nov. 2, 2023) developed by Tirunelveli Subramaniam Ravi, San Jose, California, and Bishnu Gogoi, Scottsdale, Arizona, for "Integrated method for low-cost wide band gap semiconductor device manufacturing." . . .

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Integrated Method for Low-Cost Wide Band Gap Semiconductor Device Manufacturing

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