Friday - May 17, 2024

Conductive via of Integrated Circuitry, Memory Array Comprising Strings of Memory Cells, Method of Forming a Conductive via of Integrated Circuitry, and Method of Forming a Memory Array Comprising Strings of Memory Cells

2024-04-30

ALEXANDRIA, Virginia, April 30 -- MICRON TECHNOLOGY, INC., Boise, Idaho has been assigned a patent (No. US 11972978 B2, initially filed May 4, 2022) developed by three inventors Yiping Wang, Boise, Idaho; Jordan D. Greenlee, Boise, Idaho; and Collin Howder, Boise, Idaho, for "Conductive via of integrated circuitry, memory array comprising strings of memory cells, method of forming a conductive via of integrated circuitry, and method of forming a memory array comprising strings of memory cells." . . .

Information Request Form

Name:
Category that best fits the type of business or agency you are affiliated with:	Government Newspaper / Media Business Public Policy Individual / Student Educators
Company Name:
Email:
Phone:
State:

I'd like to have a copy of this article mailed to me.

To also receive a free sample of other Targeted News products check the appropriate boxes below.
Golf Handicap site (FairwayFiles.com)
Products marked with ** can be customized by keywords or areas of interest. If you select them please specify your keywords in the box below:

If we need to contact you please specify your preferred contact method. Have a representative contact me by phone
Have a representative contact me via email

Additonal questions or comments:

Click here for more information or a free trial

Existing Customer Login

Conductive via of Integrated Circuitry, Memory Array Comprising Strings of Memory Cells, Method of Forming a Conductive via of Integrated Circuitry, and Method of Forming a Memory Array Comprising Strings of Memory Cells

Information Request Form

Copyright Targeted News Service 2024