Friday - May 17, 2024

High Density Pillar Interconnect Conversion With Stack to Substrate Connection

2024-04-30

ALEXANDRIA, Virginia, April 30 -- MICRON TECHNOLOGY, INC., Boise, Idaho has been assigned a patent (No. US 11973062 B2, initially filed Feb. 15, 2023) developed by three inventors Owen R. Fay, Boise, Idaho; Kyle K. Kirby, Eagle, Idaho; and Akshay N. Singh, Boise, Idaho, for "High density pillar interconnect conversion with stack to substrate connection." . . .

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High Density Pillar Interconnect Conversion With Stack to Substrate Connection

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