Nanotwin Copper Materials in Semiconductor Devices
Copyright © Targeted News Service 2024
2024-04-30
ALEXANDRIA, Virginia, April 30 -- APPLIED MATERIALS, INC., Santa Clara, California has been assigned a patent (No. US 11973034 B2, initially filed Aug. 25, 2021) developed by five inventors Eric J. Bergman, Kalispell, Montana; John L. Klocke, Kalispell, Montana; Marvin L. Bernt, Kalispell, Montana; Jing Xu, Kalispell, Montana; and Kwan Wook Roh, Kalispell, Montana, for "Nanotwin copper materials in semiconductor devices." . . .