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Skorpios Technologies Assigned Patent for Method and System for Template Assisted Wafer Bonding

2016-10-06

ALEXANDRIA, Va., Oct. 6 -- Skorpios Technologies, Albuquerque, New Mexico, has been assigned a patent (9,461,026) developed by two co-inventors for a "method and system for template assisted wafer bonding." The co-inventors are John Dallesasse, Geneva, Illinois, and Stephen B. Krasulick, Albuquerque, New Mexico.

The patent application was filed on April 4, 2014 (14/245,191). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITO . . .

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Skorpios Technologies Assigned Patent for Method and System for Template Assisted Wafer Bonding

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