Saturday - April 26, 2025
Microchip Unveils New High-Density Power Module for AI at the Edge Applications
April 25, 2025
CHANDLER, Arizona, April 25 -- Microchip Technology, a provider of smart, connected and secure embedded control solutions, issued the following news release:

* * *

Microchip Unveils New High-Density Power Module for AI at the Edge Applications

The MCPF1412 power module with integrated I2C and PMBus interfaces for flexible configuration and monitoring

CHANDLER, Ariz., April 24, 2025 --AI at the edge is driving increased integration and power co . . .

Targeted News Service Document Request Form

This document is available to you by e-mail if you complete the form below with relevant information. There may be a fee for this article or ongoing service of similar materials. We will be in touch shortly.

Name:
What's your
Affiliation		 Government Newspaper / Media Business
Public Policy Individual / Student Educators
Email:
Phone:
Organization, if any:
State/Country you are in:
Additonal questions
or comments:

Click here for more information about our products

Click here for more information about our products