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U.S. Department of Commerce Announces $1.4 Billion in Final Awards to Support the Next Generation of U.S. Semiconductor Advanced Packaging
January 16, 2025
WASHINGTON, Jan. 16 -- The U.S. Department of Commerce issued the following news release:

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U.S. Department of Commerce Announces $1.4 Billion in Final Awards to Support the Next Generation of U.S. Semiconductor Advanced Packaging

Thursday, January 16, 2025

Office of Public Affairs

publicaffairs@doc.gov (link sends email)

Today, the U.S. Department of Commerce has announced that CHIPS National Advanced Packaging Ma . . .

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