SIA Commends Finalization of CHIPS Incentives for New Hemlock Polysilicon Manufacturing Facility in Michigan
January 08, 2025
January 08, 2025
WASHINGTON, Jan. 8 (TNSsta)(TNSres) -- The Semiconductor Industry Association issued the following statement on Jan. 7, 2025:
* * *
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending finalization of CHIPS and Science Act manufacturing investments announced by the U.S. Department of Commerce and Hemlock Semiconductor (HSC). The CHIPS incentives finalized today will support the constructio . . .
* * *
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending finalization of CHIPS and Science Act manufacturing investments announced by the U.S. Department of Commerce and Hemlock Semiconductor (HSC). The CHIPS incentives finalized today will support the constructio . . .