SIA Commends Finalization of CHIPS Incentives for TSMC
November 16, 2024
November 16, 2024
WASHINGTON, Nov. 16 -- The Semiconductor Industry Association issued the following statement on Nov. 15, 2024:
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The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding finalization of the agreement to allocate incentives to TSMC under the CHIPS and Science Act. The agreement between TSMC and the U.S. Department of Commerce will support the expansion of TSMC's semiconductor fabs in Arizon . . .
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The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding finalization of the agreement to allocate incentives to TSMC under the CHIPS and Science Act. The agreement between TSMC and the U.S. Department of Commerce will support the expansion of TSMC's semiconductor fabs in Arizon . . .