SIA Applauds CHIPS Incentives for Hemlock Manufacturing Expansion in Michigan
October 22, 2024
October 22, 2024
WASHINGTON, Oct. 22 -- The Semiconductor Industry Association issued the following statement on Oct. 21, 2024:
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The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Department of Commerce and Hemlock Semiconductor (HSC).
Today's announced incentives are designed to help HSC build a new hyper-pure semiconductor-g . . .
* * *
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Department of Commerce and Hemlock Semiconductor (HSC).
Today's announced incentives are designed to help HSC build a new hyper-pure semiconductor-g . . .