Tokyo Institute of Technology: Breakthrough in Semiconductor Patterning - New Block Copolymer Achieves 7.6nm Line Width
September 03, 2024
September 03, 2024
TOKYO, Japan, Sept. 3 (TNSres) -- Tokyo Institute of Technology issued the following news release:
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A recently developed block copolymer could help push the limits of integration and miniaturization in semiconductor manufacturing, report scientists in Tokyo Tech and TOK. Chemically tailored for reliable directed self-assembly, the proposed compound can arrange itself into perpendicular lamellar structures whose half-pitch width is less than 10 nanometers, outperfor . . .
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A recently developed block copolymer could help push the limits of integration and miniaturization in semiconductor manufacturing, report scientists in Tokyo Tech and TOK. Chemically tailored for reliable directed self-assembly, the proposed compound can arrange itself into perpendicular lamellar structures whose half-pitch width is less than 10 nanometers, outperfor . . .