Biden-Harris Administration Announces Preliminary Terms with HP to Support Development and Commercialization of Cutting-Edge Semiconductor Technologies
August 27, 2024
August 27, 2024
WASHINGTON, Aug. 27 -- The U.S. Department of Commerce issued the following news release:
Proposed Investment Would Support Expansion and Modernization of Existing Campus and Create Over 250 Manufacturing and Construction Jobs
Today, the Biden-Harris Administration announced that the Department of Commerce and HP Inc. have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $50 million in proposed direct funding under the CHIPS and Science Act. T . . .
Proposed Investment Would Support Expansion and Modernization of Existing Campus and Create Over 250 Manufacturing and Construction Jobs
Today, the Biden-Harris Administration announced that the Department of Commerce and HP Inc. have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $50 million in proposed direct funding under the CHIPS and Science Act. T . . .