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Watson College Professor Named IEEE Fellow for Electronics Packaging Research
December 19, 2023
BINGHAMTON, New York, Dec. 19 (TNSres) -- Binghamton University issued the following news:

By Chris Kocher

As consumer demand for the latest and greatest gadgets has accelerated over the past 20 years, microchip manufacturers are not the only ones who need to keep up.

Electronics packaging -- everything that ensures your device's optimum performance apart from the silicon chips -- also has evolved quickly to match those rapid advances.

Binghamt . . .

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