ALEXANDRIA, Virginia, April 16 -- MONOLITHIC 3D INC., Klamath Falls, Oregon has been assigned a patent (No. US 11961827 B1, initially filed Dec. 23, 2023) developed by Zvi Or-Bach, Haifa, Israel, and Brian Cronquist, Klamath Falls, Oregon, for "3D semiconductor device and structure with metal layers." . . .