Heterogeneous Packaging Integration of Photonic and Electronic Elements
Copyright © Targeted News Service 2024
2024-04-23
ALEXANDRIA, Virginia, April 24 -- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsin-Chu, Taiwan has been assigned a patent (No. US 11966090 B2, initially filed March 3, 2021) developed by three inventors Stefan Rusu, Hsin-Chu, Taiwan; Wei-Wei Song, Sunnyvale, California; and Mohammed Rabiul Islam, Austin, Texas, for "Heterogeneous packaging integration of photonic and electronic elements." . . .