Microelectronic Device Assemblies and Packages Including Multiple Device Stacks and Related Methods
Copyright © Targeted News Service 2024
2024-04-16
ALEXANDRIA, Virginia, April 16 -- MICRON TECHNOLOGY, INC., Boise, Idaho has been assigned a patent (No. US 11961825 B2, initially filed June 7, 2022) developed by four inventors Aparna U. Limaye, Boise, Idaho; Dong Soon Lim, Boise, Idaho; Randon K. Richards, Kuna, Idaho; and Owen R. Fay, Meridian, Idaho, for "Microelectronic device assemblies and packages including multiple device stacks and related methods." . . .