Semiconductor Device Assemblies Including Multiple Stacks of Different Semiconductor Dies
Copyright © Targeted News Service 2024
2024-04-16
ALEXANDRIA, Virginia, April 16 -- MICRON TECHNOLOGY, INC., Boise, Idaho has been assigned a patent (No. US 11961821 B2, initially filed Aug. 5, 2022) developed by Blaine J. Thurgood, Nampa, Idaho, for "Semiconductor device assemblies including multiple stacks of different semiconductor dies." . . .