Three-Dimensional Memory Device With Dielectric or Semiconductor Wall Support Structures and Method of Forming the Same
Copyright © Targeted News Service 2024
2024-04-16
ALEXANDRIA, Virginia, April 16 -- SANDISK TECHNOLOGIES LLC, Addison, Texas has been assigned a patent (No. US 11963354 B2, initially filed Sept. 7, 2021) developed by Tomohiro Kubo, Yokkaichi, Japan, for "Three-dimensional memory device with dielectric or semiconductor wall support structures and method of forming the same." . . .