Sunday - June 2, 2024

Efficient Wave Guide Transition Between Package and PCB Using Solder Wall

2024-04-16

ALEXANDRIA, Virginia, April 16 -- NXP B.V., Eindhoven, Netherlands has been assigned a patent (No. US 11963291 B2, initially filed April 21, 2022) developed by Leo van Gemert, Nijmegen, Netherlands, and Michael B. Vincent, Chandler, Arizona, for "Efficient wave guide transition between package and PCB using solder wall." . . .

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Efficient Wave Guide Transition Between Package and PCB Using Solder Wall

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