Integration of Semiconductor Device Assemblies With Thermal Dissipation Mechanisms
Copyright © Targeted News Service 2024
2024-04-16
ALEXANDRIA, Virginia, April 16 -- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, Arizona has been assigned a patent (No. US 11961782 B2, initially filed Dec. 17, 2020) developed by three inventors Seungwon Im, Seoul, South Korea; Dongwook Kang, Bucheon, South Korea; and Oseob Jeon, Seoul, South Korea, for "Integration of semiconductor device assemblies with thermal dissipation mechanisms." . . .