Sunday - June 2, 2024

Flip Chip Packaged Devices With Thermal Pad

2024-04-09

ALEXANDRIA, Virginia, April 9 -- TEXAS INSTRUMENTS INC., Dallas, Texas has been assigned a patent (No. US 11955456 B2, initially filed June 30, 2021) developed by five inventors Anindya Poddar, Sunnyvale, California; Ashok Surendra Prabhu, San Jose, California; Hau Nguyen, San Jose, California; Kurt Edward Sincerbox, San Jose, California; and Makoto Shibuya, Tokyo, Japan, for "Flip chip packaged devices with thermal pad." . . .

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Flip Chip Packaged Devices With Thermal Pad

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