Sunday - June 2, 2024

Glass Electrochemical Sensor With Wafer Level Stacking and Through Glass via (TGV) Interconnects

2024-04-09

ALEXANDRIA, Virginia, April 9 -- CORNING INC., Corning, New York has been assigned a patent (No. US 11953462 B2, initially filed March 16, 2023) developed by three inventors Robert Alan Bellman, Ithaca, New York; Jeffrey Stapleton King, Menlo Park, California; and Scott Christopher Pollard, Big Flats, New York, for "Glass electrochemical sensor with wafer level stacking and through glass via (TGV) interconnects." . . .

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Glass Electrochemical Sensor With Wafer Level Stacking and Through Glass via (TGV) Interconnects

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