Semiconductor Assemblies Using Edge Stacking and Methods of Manufacturing the Same
Copyright © Targeted News Service 2024
2024-04-09
ALEXANDRIA, Virginia, April 9 -- MICRON TECHNOLOGY, INC., Boise, Idaho has been assigned a patent (No. US 11955457 B2, initially filed Dec. 8, 2020) developed by Thomas H. Kinsley, Boise, Idaho, for "Semiconductor assemblies using edge stacking and methods of manufacturing the same." . . .