Etch Barrier for Microelectronic Packaging Conductive Structures
Copyright © Targeted News Service 2024
2024-04-02
ALEXANDRIA, Virginia, April 2 -- INTEL CORPORATION, Santa Clara, California has been assigned a patent (No. US 11948898 B2, initially filed May 16, 2019) developed by five inventors Kristof Darmawikarta, Chandler, Arizona; Srinivas V. Pietambaram, Chandler, Arizona; Hongxia Feng, Chandler, Arizona; Xiaoying Guo, Chandler, Arizona; and Benjamin T. Duong, Chandler, Arizona, for "Etch barrier for microelectronic packaging conductive structures." . . .