Sunday - June 2, 2024

Hybrid Backside Thermal Structures for Enhanced IC Packages

2024-04-02

ALEXANDRIA, Virginia, April 2 -- INTEL CORPORATION, Santa Clara, California has been assigned a patent (No. US 11948906 B2, initially filed Feb. 7, 2020) developed by five inventors Feras Eid, Chandler, Arizona; Joe Walczyk, Tigard, Oregon; Weihua Tang, Chandler, Arizona; Akhilesh Rallabandi, Chandler, Arizona; and Marco Aurelio Cartas Ayala, Chandler, Arizona, for "Hybrid backside thermal structures for enhanced IC packages." . . .

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Hybrid Backside Thermal Structures for Enhanced IC Packages

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